[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Chip embedding technology for power applications
Ostmann, Andreas, Boettcher, Lars, Karaszkiewicz, Stefan, Schuetze, David, Manessis, DionysiosYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699484
File:
PDF, 82 KB
english, 2010