[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - CVD Cu technology development for advanced Cu interconnect applications
Cheng-Hong Lee,, Kuei-Hung Shen,, Tzu-Kun Ku,, Cheng-Hung Luo,, Chia-Chun Tao,, Hung-Wen Chou,, Chin Hsia,Year:
2000
Language:
english
DOI:
10.1109/iitc.2000.854337
File:
PDF, 352 KB
english, 2000