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[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Effects of N doping in Ru-Ta alloy barrier on film property and reliability for Cu interconnects
Torazawa, Naoki, Hinomura, Toru, Mori, Kenichi, Koyama, Yuki, Hirao, Shuji, Kobori, Etsuyoshi, Korogi, Hayato, Maekawa, Kazuyoshi, Tomita, Kazuo, Chibahara, Hiroyuki, Suzumura, Naohito, Asai, Koyu, MiYear:
2009
Language:
english
DOI:
10.1109/iitc.2009.5090356
File:
PDF, 984 KB
english, 2009