[IEEE 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Austin, TX, USA (2010.10.25-2010.10.27)] 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems - BSM pin assignment with differential pairing on multiple layer designs
Xiang, Hua, Zhou, Tingdong, Puri, Ruchir, Becker, Wiren D.Year:
2010
Language:
english
DOI:
10.1109/epeps.2010.5642573
File:
PDF, 667 KB
english, 2010