[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - New packaging technology enabling integration of magnetics and semiconductors in one component
Pot, Abel, Roehm, Horst, Berg, Rinus v. d., Sidiki, Tamim P.Year:
2009
Language:
english
DOI:
10.1109/icept.2009.5270804
File:
PDF, 1.47 MB
english, 2009