[IEEE 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. - Shangri-La's Rasa Sentosa Resort, Singapore (27 June-1July, 2005)] Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. - The effect of ultrasonic cleaning on the bond wires
Jiang Yuqi,, Tang Dong,, Song Xianzhong,, Lam Tim Fai,Year:
2005
Language:
english
DOI:
10.1109/ipfa.2005.1469170
File:
PDF, 860 KB
english, 2005