A thermal benchmark chip: design and applications

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1998 / Sept. Vol. 21; Iss. 3

A thermal benchmark chip: design and applications

Szekely, V., Marta, C., Rencz, M., Vegh, G., Benedek, Z., Torok, S.
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Volume:
21
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.725202
Date:
January, 1998
File:
PDF, 474 KB
english, 1998
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