[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Application of numerical analysis to the reliability assessment of a novel package on package (PoP) structure for memory stacking
Kao, Kuo-Shu, Wu, Sheng-Tsai, Hung, Yin-Po, Chang, Tao-Chih, Cheng, Ren-Shin, Chen, Tai-HongYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699573
File:
PDF, 548 KB
english, 2010