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Assembly of Copper Column Interconnect Flip Chip
Lin, Ta-Hsuan, Menezes, Arun S., Andros, Frank, McBride, Donald G., Lu, Susan, Sammakia, BahgatVolume:
30
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2007.899149
Date:
July, 2007
File:
PDF, 1.21 MB
english, 2007