[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Electromigration reliability of redistribution lines in wafer-level chip-scale packages
Lai, Yi-Shao, Kao, Chin-Li, Chiu, Ying-Ta, Appelt, Bernd K.Year:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898533
File:
PDF, 1.35 MB
english, 2011