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[IEEE High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - (2007.06.26-2007.06.28)] High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - Power Integrity in Silicon-Package-Board Codesign Flow
Dai, WenliangYear:
2007
Language:
english
DOI:
10.1109/hdp.2007.4283601
File:
PDF, 242 KB
english, 2007