[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - Influence of Sb addition on microstructural evolution of Sn-Ag solder
Hwa-Teng Lee,, Ming-Hung Chen,, Shuen-Yuan Hu,, Cheng-Shyan Li,Year:
2002
Language:
english
DOI:
10.1109/emap.2002.1188827
File:
PDF, 745 KB
english, 2002