[IEEE IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging - West Point, NY, USA (26-28 Oct. 1998)] IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370) - Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz
Jaeyong Jeong,, Jichai Jeong,Year:
1998
Language:
english
DOI:
10.1109/epep.1998.733750
File:
PDF, 296 KB
english, 1998