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[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Towards a Robust Design of Electronics Assemblies under Fracture, Delamination and Fatigue Aspects
Juergen, Auersperg, Bernd, MichelYear:
2007
Language:
english
DOI:
10.1109/eptc.2007.4469825
File:
PDF, 728 KB
english, 2007