[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Electromigration Reliability of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu Composite Flip-chip Solder Bumps with Ti/Ni(V)/Cu Under Bump Metallurgy

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