A method of the measurement of moisture in IC packages...

IEEE Transactions on Electronics Packaging Manufacturing 2003 / 07 Vol. 26; Iss. 3

A method of the measurement of moisture in IC packages using microwaves

Yang Ju,, Saka, M., Abe, H.
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Volume:
26
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2003.820808
Date:
July, 2003
File:
PDF, 323 KB
english, 2003
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