[IEEE 2008 58th Electronic Components and Technology...

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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Ternary lead-free SnAgCu micro-bumps for ultra-fine pitch chip-to-chip interconnection

Tsung-Fu Tsai,, Jing-Yao Chang,, Chien-Wei Chien,, Jing-Ye Juang,, Li-Cheng Shen,
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Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4549950
File:
PDF, 1.66 MB
english, 2008
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