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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Molded underfill (MUF) technology for flip chip packages in mobile applications
Joshi, M., Pendse, R., Pandey, V., Lee, T. K., Yoon, I. S., Yun, J. S., Kim, Y. C., Lee, H. R.Year:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490861
File:
PDF, 1.11 MB
english, 2010