[IEEE 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2013.10.27-2013.10.30)] 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems - Analysis and verification of board power delivery network impact on DDR3L memory interface in ARM SoC application
Tran, Dinh T., Kim, GaWon, Min, Max Sunghwan, Bautista, Harold, Zhou, Nian, Choi, Baekkyu, Cha, Seungyong, You, Se-hoYear:
2013
Language:
english
DOI:
10.1109/epeps.2013.6703502
File:
PDF, 947 KB
english, 2013