[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Role of process gases in making tapered through-silicon vias for 3D MEMS packaging
Dixit, Pradeep, Vahanen, Sami, Salonen, Jaakko, Monnoyer, PhilippeYear:
2012
Language:
english
DOI:
10.1109/impact.2012.6420230
File:
PDF, 12.18 MB
english, 2012