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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Electromigration-induced interfacial reactions in line-type Cu/Sn/ENIG interconnect
Shaoming Zhou,, Huang, Mingliang, Chen, LeidaYear:
2010
Language:
english
DOI:
10.1109/icept.2010.5583790
File:
PDF, 4.07 MB
english, 2010