Gas-assisted evaporative cooling of high density electronic...

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1995 / Sept. Vol. 18; Iss. 3

Gas-assisted evaporative cooling of high density electronic modules

Bar-Cohen, A., Sherwood, G., Hodes, M., Solbreken, G.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.465144
Date:
January, 1995
File:
PDF, 814 KB
english, 1995
Conversion to is in progress
Conversion to is failed