[IEEE 3rd Electronics Packaging Technology Conference - Singapore (5-7 Dec 2000)] Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) - Flip chip pin grid array (FC-PGA) packaging technology
Hwai Peng Yeoh,, Mirng-Ji Lii,, Sankman, B., Azimi, H.Year:
2000
Language:
english
DOI:
10.1109/eptc.2000.906346
File:
PDF, 736 KB
english, 2000