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[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Demonstration of TFHM scalability to 32 nm node BEOL interconnect and extendibility to ELK k ≤ 2.3 dielectric material
Hamioud, K., Arnal, V., Farcy, A., Jousseaume, V., Zenasni, A., Gourhant, O., Icard, B., Pradelles, J., Manakli, S., Brun, Ph., Imbert, G., Jayet, C., Assous, M., Maitrejean, S., Vilmay, M., Galpin, DYear:
2009
Language:
english
DOI:
10.1109/iitc.2009.5090370
File:
PDF, 314 KB
english, 2009