IEEE Transactions on Components Packaging and Manufacturing Technology Part A
1997 / Dec. Vol. 20; Iss. 4
High power multichip modules employing the planar embedding technique and microchannel water heat sinks
Hahn, R., Kamp, A., Ginolas, A., Schmidt, M., Wolf, J., Glaw, V., Topper, M., Ehrmann, O., Reichl, H.Volume:
20
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.650932
Date:
January, 1997
File:
PDF, 349 KB
english, 1997