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[IEEE 2005 International Conference on Asian Green Electronics - Shanghai, China (15-18 March 2005)] Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. - Micro-bga package reliability and optimization of reflow soldering profile

Jingang Gao,, Yiping Wu,, Han Ding,
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Year:
2005
Language:
english
DOI:
10.1109/agec.2005.1452333
File:
PDF, 774 KB
english, 2005
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