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[IEEE ESSDERC 2011 - 41st European Solid State Device Research Conference - Helsinki, Finland (2011.09.12-2011.09.16)] 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC) - 3D stack packaging solution for BAW devices: 3D packaging demonstrator and RF performance
Sun, X., Posada, G., Majeed, B., Zhang, W., De Raedt, W., Diekmann, C., Eggs, C., Schmidhammer, E.Year:
2011
Language:
english
DOI:
10.1109/essderc.2011.6044218
File:
PDF, 907 KB
english, 2011