[IEEE 2006 IEEE Electrical Performane of Electronic...

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[IEEE 2006 IEEE Electrical Performane of Electronic Packaging - Scottsdale, AZ, USA (2006.10.23-2006.10.25)] 2006 IEEE Electrical Performane of Electronic Packaging - Frequency-Domain Finite Element Electrodynamic Modeling of Lossy Interconnects from DC to Multi-GHz Frequencies

Wu, Hong, Rong, Aosheng, Cangellaris, Andreas
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Year:
2006
Language:
english
DOI:
10.1109/epep.2006.321165
File:
PDF, 4.20 MB
english, 2006
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