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[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Dynamic analysis of wirebonding process on Cu/low-K wafers
Chang-Lin Yeh,, Yi-Shao Lai,, Jenq-Dah Wu,Year:
2003
Language:
english
DOI:
10.1109/eptc.2003.1271529
File:
PDF, 317 KB
english, 2003