TSV Redundancy: Architecture and Design Issues in 3-D IC

IEEE Transactions on Very Large Scale Integration (VLSI) Systems 2012 / 04 Vol. 20; Iss. 4

TSV Redundancy: Architecture and Design Issues in 3-D IC

Hsieh, Ang-Chih, Hwang, TingTing
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Volume:
20
Language:
english
Journal:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
DOI:
10.1109/tvlsi.2011.2107924
Date:
April, 2012
File:
PDF, 1.34 MB
english, 2012
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