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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Fabrication and in-situ evaluation of copper TSV interconnection
Ma, Shenglin, Zhu, Yunhui, Sun, Xin, Miao, Min, Chen, Jin, Jin, YufengYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066801
File:
PDF, 2.16 MB
english, 2011