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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Characterization of fine-pitch solder bump joint and package warpage for low K high-pin-count flip-chip BGA through Shadow Moiré and Micro Moiré techniques
Liu, An-Hong, Wang, David W., Huang, Hsiang-Ming, Sun, Ming, Lin, Muh-Ren, Zhong, Chonghua, Hwang, Sheng-Jye, Lu, Hsuan-HengYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898547
File:
PDF, 5.61 MB
english, 2011