Conductive adhesives for high-frequency applications

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1998 / Sept. Vol. 21; Iss. 3

Conductive adhesives for high-frequency applications

Sihlbom, R., Dernevik, M., Lai, Z., Starski, J.P., Liu, J.
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Volume:
21
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.725211
Date:
January, 1998
File:
PDF, 305 KB
english, 1998
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