Depth profiling of a Co-implanted silicon wafer by total-reflection X-ray fluorescence analysis after repeated oxidation and HF-etching
Klockenkämper, R., von Bohlen, A.Volume:
36
Year:
1999
Language:
english
Journal:
Analytical Communications
DOI:
10.1039/a809804b
File:
PDF, 121 KB
english, 1999