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An optimization study of underfill dispensing volume
YewChoon Chia,, HongSee Yam,, Lim, S.H., Chian, K.S., Sung Yi,, Chen, W.T.Volume:
26
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2003.820812
Date:
July, 2003
File:
PDF, 908 KB
english, 2003