[IEEE 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (21-25 July 1997)] Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Finite element analysis for solder ball failures in chip scale package
Taekoo Lee,, Jinhyuk Lee,, Ilgyu Jung,Year:
1997
Language:
english
DOI:
10.1109/ipfa.1997.638070
File:
PDF, 747 KB
english, 1997