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Numerical analysis of fine lead bonding-effect of pad thickness on interfacial deformation
Takahashi, Y., Inoue, M., Inoue, K.Volume:
22
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.774748
Date:
June, 1999
File:
PDF, 437 KB
english, 1999