[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - TSV stress testing and modeling
Amagai, Masazumi, Suzuki, YutakaYear:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490650
File:
PDF, 1.22 MB
english, 2010