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[IEEE Proceedings of the IEEE 2001 International Interconnect Technology Conference - Burlingame, CA, USA (2001.06.6-2001.06.6)] Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) - Proximity dummy feature placement and selective via sizing for process uniformity in a trench-first-via-last dual-inlaid metal process
Ruiqi Tian,, Boone, R., Chheda, S., Smith, B., Xiaoping Tang,, Travis, E., Wong, D.F.Year:
2001
Language:
english
DOI:
10.1109/iitc.2001.930013
File:
PDF, 448 KB
english, 2001