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[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Power supply noise-aware 3D floorplanning for system-on-package

Eric Wong,, Minz, J., Sung Kyu Lim,
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Year:
2005
Language:
english
DOI:
10.1109/epep.2005.1563753
File:
PDF, 996 KB
english, 2005
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