Mechanical Characterization and Performance Optimization...

IEEE Transactions on Electronics Packaging Manufacturing 2007 / 07 Vol. 30; Iss. 3

Mechanical Characterization and Performance Optimization for GPU Fan-Sink Cooling Module Assembly

Chen, Ching-I, Ni, Ching-Yu, Lee, Cheng-Chung, Pan, Hsin-Yu, Yuan, Tsorng-Dih
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
30
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2007.899147
Date:
July, 2007
File:
PDF, 1.39 MB
english, 2007
Conversion to is in progress
Conversion to is failed