[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Thermal stress analysis and failure mechanisms for through silicon via array
Kuo, Chi-Wei, Tsai, Hung-YinYear:
2011
Language:
english
DOI:
10.1109/impact.2011.6117254
File:
PDF, 840 KB
english, 2011