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Evaluation of Thermal Resistance Matrix Method for an Embedded Power Electronic Module
Mital, M., Ying-Feng Pang,, Scott, E.P.Volume:
31
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2008.916836
Date:
June, 2008
File:
PDF, 677 KB
english, 2008