[IEEE 2006 International Electron Devices Meeting - San Francisco, CA, USA (2006.12.11-2006.12.13)] 2006 International Electron Devices Meeting - Plasma Co-polymerization Technology with Molecular-level Structure Tightening in "In-situ" SiOCH Stacks for 32nm-node Cu Interconnects
Tada, M., Yamamoto, H., Ito, F., Narihiro, M., Ueki, M., Inoue, N., Abe, M., Saito, S., Takeuchi, T., Furutake, N., Onodera, T., Kawahara, J., Arai, K., Kasama, Y., Taiji, T., Tohara, M., Sekine, M.,Year:
2006
Language:
english
DOI:
10.1109/iedm.2006.346781
File:
PDF, 436 KB
english, 2006