[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Stress Relaxation Characterization of Hypoeutectic Sn3.0Ag0.5Cu Pb-free Solder: Experiment and Modeling
Cuddalorepatta, Gayatri, Herkommer, Dominik, Dasgupta, AbhijitYear:
2007
Language:
english
DOI:
10.1109/esime.2007.360038
File:
PDF, 9.73 MB
english, 2007