[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Chip to chip hermetic bonding and multi-chip stacking using CuSn bonding technology
Sekhar, V. N., Su, Lee Jun, Toh Wai Hong, Justin See, Bangtao, ChenYear:
2013
Language:
english
DOI:
10.1109/eptc.2013.6745699
File:
PDF, 1.30 MB
english, 2013