In Situ Measurement and Stress Evaluation for Wire Bonding...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 02 Vol. 3; Iss. 2

In Situ Measurement and Stress Evaluation for Wire Bonding Using Embedded Piezoresistive Stress Sensors

Yong, Woon Yik, Zhang, Xiaowu, Chai, Tai Chong, Trigg, Alastair, Jaafar, Norhanani Binte, Lo, Guo-Qiang
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2012.2217141
Date:
February, 2013
File:
PDF, 2.38 MB
english, 2013
Conversion to is in progress
Conversion to is failed