[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - 3D Simulation of fine pitch underfill encapsulation
Hsu, Chih-Chung, Chiu, Hsien-Sen, Yang, Wen-Hsien, Chang, Rong-YeuYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699570
File:
PDF, 841 KB
english, 2010