[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - A low temperature wafer-level hermetic MEMS package using UV curable adhesive
Zhi-Hao Liang,, Cheng, Y.T., Hsu, W., Yuh-Wen Lee,Year:
2004
Language:
english
DOI:
10.1109/ectc.2004.1320311
File:
PDF, 555 KB
english, 2004