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[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - An experimental investigation of current stressing on wafer-level chip-scale packages
Lai, Yi-shao, Kung, Heng-yu, Chen, Po-ying, Yeh, Wen-kuanYear:
2006
Language:
english
DOI:
10.1109/eptc.2006.342778
File:
PDF, 504 KB
english, 2006